Ming Hsieh Department of Electrical Engineering assistant professor, Paul Bogdan, and his collaborators received a best paper award at the 18th Asia and South Pacific Design Automation Conference. The paper was co-authored with Hiroki Matsutani (Keio University), Radu Marculescu (Carnegie Mellon University), Yasuhiro Take (Keio University), Daisuke Sasaki (Keio University), Hao Zhang (Keio University), Michihiro Koibuchi (National Institute of Informatics), Tadahiro Kuroda (Keio University), and Hideharu Amano (Keio University).
To overcome the increasing design costs of custom System-on-Chips (SoCs) in recent process technologies, System-in-Packages (SiPs) or 3D ICs can be used to select and stack necessary known-good-dies in response to given application requirements. In this context, providing a large degree of flexibility and connectivity between known-good-dies is essential. Their winning paper entitled “A Case for Wireless 3D NoCs for CMPs” addresses this problem and presents a topology-agnostic 3D CMP architecture using inductive-coupling that offers great flexibility in customizing the number of processor chips, SRAM chips, and DRAM chips in SiPs. To cope with the irregularity of wireless 3D CMPs, the paper proposes a plug-and-play routing protocol which exchanges network information between all chips to establish routing paths that are free from deadlocks based on spanning trees. In addition, the newly proposed technique for optimizing the spanning trees analyzes the application traffic patterns and selects the best spanning tree root for each message class such that the average hop count and the application execution times are minimized.